Huawei reportedly making its own HBM chips to sidestep US sanctions


Huawei Technologies has partnered with local Chinese companies to develop high-bandwidth memory (HBM) chips often used in AI infrastructure.

Since 2019, after the US imposed sanctions restricting Huawei’s ability to use technologies made by Western companies, Huawei has been trying to develop its domestic tech industry.

In the latest move, the company has started to produce HBM chips locally, which are designed to provide high-speed data and low power consumption.

According to South China Morning Post, Huawei teamed up with Chinese foundry Wuhan Xinxin Semiconductor Manufacturing, and packaging firms Jiangsu Changjiang Electronics Tech, and Tongfu Microelectronics to produce HBM chips.

This move will be challenging as Huawei is only now entering the HBM market dominated by South Korean companies like SK Hynix and Samsung Electronics.

However, history shows that the company is capable of achieving technological advancements despite sanctions.

Huawei surprised many by launching flagships like Mate 60 Pro and Pura 70 made with 7nm process technology – a milestone some thought would take years to reach. Bloomberg reported that the chips, though, were made using Western equipment.

HBM is increasingly used to produce AI chips as it provides extremely high memory bandwidth, which is essential for the rapid processing of AI workloads.

Right now, the biggest HBM makers have limited ability to produce enough HBM due to the high demand. Earlier this year, SK Hynix reported that HBM chips used in AI chipsets were sold out for this year and almost sold out for 2025.



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